TSMC announced plans to invest over $100 billion in expanding its U.S. chip manufacturing operations, including three new chip plants, two packaging facilities, and an R&D center in Arizona. The significant expansion was announced jointly by TSMC CEO C.C. Wei and President Trump at the White House.
TSMC's 2nm Platform Technology presentation at IEDM 2024 showcased a 30% power improvement and 15% performance gain compared to their 3nm node, with promising early yield reports indicating >80% average yield for 256Mb SRAM arrays. The technology positions TSMC as a leader in density and power efficiency among 2nm class processes, though Intel's 18A may lead in performance, while pricing concerns at $30,000 per wafer could impact market adoption.