TSMC Faces Tough Choices Amid Rumors for Intel Collaboration

TSMC executives are set to negotiate with the U.S. government over three potential cooperation options, including setting up an advanced packaging factory and potentially partnering with Intel Foundry Services. The proposed arrangements could significantly impact TSMC's operations and relationships with existing partners, while raising concerns about balancing U.S. interests with shareholder value.

IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up? - Semiwiki

TSMC's 2nm Platform Technology presentation at IEDM 2024 showcased a 30% power improvement and 15% performance gain compared to their 3nm node, with promising early yield reports indicating >80% average yield for 256Mb SRAM arrays. The technology positions TSMC as a leader in density and power efficiency among 2nm class processes, though Intel's 18A may lead in performance, while pricing concerns at $30,000 per wafer could impact market adoption.